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Dry Etching is widely used in nanoprocessing as a method of pattern transfer onto a hard substrate, like silicon. Improving the resolution of this etch process is an important step in reducing the feature size in, for instance, computer microchips, or Nanoimprint Lithography stamps. TheReactiveIonEtcheratLundUniversityhasrecentlybeenupgradedwithaturbo molecular pump. This allows for lower pressure
